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Head Office | #802 NEW SHIMBASHI BILL 2-16-1 Shimbashi, Minato-ku, Tokyo 105-0004, Japan TEL.+81-3-6205-8380 |
Niigata Factory | Koh 3000,Chiya,Ojiya-shi,Niigata 947-8502,Japan TEL.+81-258-83-3434 |
CEO | Akihiko Sakai |
Date of Establishment | December 1, 2022 |
Business | ・Foundry Business ・Analog and Power semiconductor Pre-processing ・Backside Processing ・Epi Growth ・Chip-size Packaging |
Factory Manager Hiroshi Ichinose
Address Koh 3000, Chiya, Ojiya-shi, Niigata
Foundation April 1st, 2023
Site Area 161,867m²
Headcount Approx. 580
Business Domain Foundry Service
FE, EPI:6φ CSP : 8φ
BG, BM, BUMP, Testing : 6/8φ
Production 365 days, 24 hours/day
*plans to launch 8” Front-End(FE) line
(In terms of timing : under consideration)
LSI | Discrete | |
Front-end | MPU (0.30um tech with one time) | PT- / NPT- / FS- /RC-IGBT |
Logic(0.35) | MOS-FETs (Planar, Trench) | |
Mixed-sigmal (BiDC) | Bip Tr/Diode | |
Back-end | Ultra-thin (with TAIKO tech, 70 um), Back metal (Ti, Ni, Cu, Au, Ag, Al, NiCr) | |
UBM(under bump metal with plating tech, NiAu, NiPdAu) | ||
STM(solder top metal with plating / lift-off tech) | ||
Bump Line | WLP(Wafer Level Package) | |
Flip chip, Ultra-thin with thick patterned Cu |